Package carrier
US9433099B2 · kind B2 · utility
0Cited by
0References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 6, 2013 |
| Grant date | Aug 30, 2016 |
| Priority date | — |
| Expiry date | Aug 8, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0156
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A package carrier including a removable supporting plate and a circuit board is provided. The removable supporting plate includes a dielectric layer, a copper foil layer and a releasing layer. The dielectric layer is disposed between the copper foil layer and the releasing layer. The circuit board is disposed on the removable supporting plate and directly contacts the releasing layer. A thickness of the circuit board is between 30 μm and 100 μm.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.