Inertial wafer centering end effector and transport apparatus
US9437469B2 · kind B2 · utility
3Cited by
5References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 27, 2007 |
| Grant date | Sep 6, 2016 |
| Priority date | — |
| Expiry date | Apr 21, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68707
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate transport apparatus for a processing tool. The apparatus has a drive section, a movable arm, and an end effector. The arm is operably connected to the drive section. The end effector is connected to the movable arm for holding and transporting the substrate in the processing tool. The apparatus has a substrate inertial capture edge grip connected to the end effector and arranged so that the grip effects capture and centering of the substrate onto the end effector from substrate inertia.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.