Patent · US Active

Chip package and method for manufacturing the same

US9437548B2 · kind B2 · utility

0Cited by

1References

20Claims

0Family size

Assignee

Infineon Technologies Austria AG · AT

Inventors

Henrik Ewe · Burglengenfeld, DE
Anton Prueckl · Schierling, DE
Joachim Mahler · Regensburg, DE
Frank Daeche · Unterhaching, DE
Josef Hoeglauer · Munich, DE
Riccardo Pittassi · Villach, AT

Key dates

Filing date	Jun 16, 2015
Grant date	Sep 6, 2016
Priority date	—
Expiry date	Jun 16, 2035

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/3025
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Various embodiments provide a chip package. The chip package may include a metallic chip carrier; at least one chip carried by the metallic chip carrier; encapsulation material encapsulating the at least one chip and the metallic chip carrier; and a plurality of redistribution layers disposed over the at least one chip opposite the metallic chip carrier, wherein at least one redistribution layer of the plurality of redistribution layers is electrically coupled with the at least one chip.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.