Concentric bump design for the alignment in die stacking
US9437551B2 · kind B2 · utility
5Cited by
3References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 13, 2014 |
| Grant date | Sep 6, 2016 |
| Priority date | — |
| Expiry date | Feb 13, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/04953
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit structure includes an alignment bump and an active electrical connector. The alignment bump includes a first non-solder metallic bump. The first non-solder metallic bump forms a ring encircling an opening therein. The active electrical connector includes a second non-solder metallic bump. A surface of the first non-solder metallic bump and a surface of the second non-solder metallic bump are substantially coplanar with each other.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.