System and method for monitoring wafer handling and a wafer handling machine
US9442482B2 · kind B2 · utility
6Cited by
2References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 29, 2013 |
| Grant date | Sep 13, 2016 |
| Priority date | — |
| Expiry date | Oct 22, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S901/27
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Systems, machines, and methods for monitoring wafer handling are disclosed herein. A system for monitoring wafer handling includes a sensor and a controller. The sensor is capable of being secured to an assembled wafer handling machine. The controller is in electronic communication with the sensor and includes control logic. The control logic is configured to store a reference output of the sensor when the wafer handling machine is aligned and is configured to generate an indication signal when a difference between the reference output and a current output of the sensor exceeds a threshold.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.