Patent · US Active

Semiconductor device and method for manufacturing a semiconductor device

US9443807B2 · kind B2 · utility

1Cited by

0References

12Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Markus Zundel · Egmating, DE
Thomas Ostermann · Velden am Wörther See, AT

Key dates

Filing date	Sep 6, 2013
Grant date	Sep 13, 2016
Priority date	—
Expiry date	Sep 6, 2033

Classification

Technology area (CPC H)Electricity
CPC primaryH10D62/117
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A device includes a semiconductor chip. An outline of a frontside of the semiconductor chip includes at least one of a polygonal line including two line segments joined together at an inner angle of greater than 90° and an arc-shaped line.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.