Embedded die redistribution layers for active device
US9443815B2 · kind B2 · utility
1Cited by
7References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 27, 2014 |
| Grant date | Sep 13, 2016 |
| Priority date | — |
| Expiry date | Jun 27, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/12042
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Embedded die packages are described that employ one or more substrate redistribution layers (RDL) to route electrode nodes and/or for current redistribution. In one or more implementations, an integrated circuit die is embedded in a copper core substrate. A substrate RDL contacts a surface of the embedded die, with at least one via (e.g., thermal via) in contact with the surface RDL to furnish electrical interconnection between the embedded die and an external contact. Additional substrate RDL or WLP RDL can be incorporated into the package to provide varying current distribution between the embedded die and external contacts.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.