Integrated circuit package

US9444135B2 · kind B2 · utility

Assignee

• Freeescale Semiconductor, Inc. · US

Inventors

• Ziqiang Tong · Ottobrunn, DE
• Ralf Reuter · Landshut, DE

Key dates

• Filing date: Sep 19, 2014
• Grant date: Sep 13, 2016
• Expiry date: Dec 17, 2034

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01Q15/006
• WIPO field: Telecommunications
• WIPO sector: Electrical engineering

Abstract

An integrated circuit package has a first side and an opposite second side. The integrated circuit package comprises: a stack of layers comprising at least a first and second electrically isolating layers, a dielectric material arranged on the stack of layers at the second side for encapsulating the integrated circuit package, a first integrated antenna structure for transmitting and/or receiving a first radio frequency signal, and a first array of electrically conductive vias extending through at least the first electrically isolating layer and the dielectric material. The first integrated antenna structure is arranged between the first and second electrically isolating layers and is surrounded by the electrically conductive vias which are electrically connected to respective first metal patches arranged on the dielectric material at the second side.