Integrate rinse module in hybrid bonding platform
US9446467B2 · kind B2 · utility
6Cited by
2References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 7, 2013 |
| Grant date | Sep 20, 2016 |
| Priority date | — |
| Expiry date | May 7, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/80986
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method includes performing a plasma activation on a surface of a first package component, removing oxide regions from surfaces of metal pads of the first package component, and performing a pre-bonding to bond the first package component to a second package component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.