Patent · US Active

Chemical mechanical polishing pad with window

US9446498B1 · kind B1 · utility

1Cited by

4References

7Claims

0Family size

Assignee

Rohm and Haas Electronic Materials CMP Holdings, Inc. · US

Inventors

Joseph So · Newark, US
Bainian Qian · Newark, US
Janet Tesfai · Cherry Hill, US

Key dates

Filing date	Mar 13, 2015
Grant date	Sep 20, 2016
Priority date	—
Expiry date	Mar 13, 2035

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB24B49/12
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

A chemical mechanical polishing pad is provided having a polishing layer; an endpoint detection window; subpad; and, a stack adhesive; wherein the subpad includes plurality of apertures in optical communication with the endpoint detection window; and, wherein the polishing surface of the polishing layer is adapted for polishing of a substrate.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.