Polyphenylene oxide resin, method of preparing polyphenylene oxide resin, polyphenylene oxide prepolymer and resin composition
US9447238B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 10, 2015 |
| Grant date | Sep 20, 2016 |
| Priority date | — |
| Expiry date | Mar 10, 2035 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2201/02
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A polyphenylene oxide resin belongs to a polymerized and/or modified thermosetting polyphenylene oxide resin, having a structure represented by formula (I):The polymerized and/or modified thermosetting polyphenylene oxide resin has better flame retardancy, thermal resistance, dielectric constant, dissipation factor, toughness, reactivity, viscosity and solubility. Therefore, the polyphenylene oxide resin is suitable for producing prepregs, resin films, laminates, printed circuit boards and other articles. A method of preparing polyphenylene oxide resins, a prepolymer thereof and a resin composition containing the polyphenylene oxide resin are also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.