Plasma process method
US9447926B2 · kind B2 · utility
1Cited by
41References
5Claims
0Family size
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Key dates
| Filing date | Feb 10, 2014 |
| Grant date | Sep 20, 2016 |
| Priority date | — |
| Expiry date | Mar 13, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T137/0324
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A plasma process method of processing an object to be processed by a plasma process while enabling cooling of an inside of a plasma apparatus by taking in and exhausting a gas to evacuate an atmosphere of the inside includes measuring a temperature of the atmosphere of the inside of the plasma process apparatus while the plasma is not generated; and stopping taking the gas into the inside of the plasma process apparatus during the plasma process in a case where the measured temperature is lower than a first preset threshold temperature when the atmosphere is evacuated at a preset volumetric flow rate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.