Memory chip package having optically and electrically connected chips, memory system having the same and driving method thereof
US9449653B2 · kind B2 · utility
3Cited by
16References
16Claims
0Family size
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Key dates
| Filing date | Dec 3, 2013 |
| Grant date | Sep 20, 2016 |
| Priority date | — |
| Expiry date | May 19, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/00014
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A memory chip package includes memory chips stacked, electrically connected one another, and configured to input and output an optical signal through an optical line formed by a via penetrating the memory chips. The memory chips input and output optical signals with different wavelengths, and each of the memory chips has an optical-electrical converter configured to convert an optical signal with a corresponding wavelength into an electrical signal and to convert an electrical signal into an optical signal with the corresponding wavelength.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.