Cooling system for molded modules and corresponding manufacturing methods

US9449895B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Inpil Yoo · Unterhaching, DE
• Carlos Castro Serrato · Unterhaching, DE

Key dates

• Filing date: May 3, 2013
• Grant date: Sep 20, 2016
• Expiry date: May 24, 2033

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/0002
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A cooling system for molded modules includes a plurality of individual modules each including a semiconductor die encapsulated by a mold compound, a plurality of leads electrically connected to the semiconductor die and at least partly uncovered by the mold compound, and a cooling plate at least partly uncovered by the mold compound. A molded body surrounds a periphery of each individual module to form a multi-die module. The leads of each individual module and the cooling plates are at least partly uncovered by the molded body. A lid with a port is attached to a periphery of the molded body at a first side of the multi-die module. The lid seals the multi-die module at the first side to form a cavity between the lid and the molded body for permitting fluid exiting or entering the port to contact the cooling plates of each individual module.