Packaging device and method of making the same
US9449933B2 · kind B2 · utility
3Cited by
14References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 29, 2012 |
| Grant date | Sep 20, 2016 |
| Priority date | — |
| Expiry date | Jul 4, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A device includes a first and a second package component. A metal trace is disposed on a surface of the first package component. The metal trace has a lengthwise direction. The second package component includes a metal pillar, wherein the second package component is disposed over the first package component. A solder region bonds the metal pillar to the metal trace, wherein the solder region contacts a top surface of the metal trace.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.