Bor-Rung Su
7Patents
2h-index
21Co-inventors
47Inventor score
Filing activity: Sep 8, 2011 → Mar 27, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9887144B2 | Ring structure for chip packaging | Electricity | 5 | Active |
| US9449933B2 | Packaging device and method of making the same | Electricity | 3 | Active |
| US11289373B2 | Semiconductor package and manufacturing method thereof | Electricity | 1 | Active |
| US10700033B2 | Packaging device and method of making the same | Electricity | 0 | Active |
| US10050001B2 | Packaging device and method of making the same | Electricity | 0 | Active |
| US11848233B2 | Semiconductor package and manufacturing method thereof | Electricity | 0 | Active |
| US9748212B2 | Shadow pad for post-passivation interconnect structures | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.