Connecting function chips to a package to form package-on-package
US9449941B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 7, 2011 |
| Grant date | Sep 20, 2016 |
| Priority date | — |
| Expiry date | Aug 8, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A package-on-package (PoP) comprises a substrate with a plurality of substrate traces, a first function chip on top of the substrate connected to the substrate by a plurality of bond-on-trace connections, and a second function chip on top of the first function chip, directly connected to the substrate. Another package-on-package (PoP) comprises: a substrate with a plurality of substrate traces, a first function chip on top of the substrate connected to the substrate by a plurality of solder mask defined (SMD) connections formed on SMD bonding pads connected to solder bumps, and a second function chip on top of the first function chip, directly connected to the substrate by a plurality of bond-on-trace connections.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.