Monomer, polymer, resist composition, and patterning process
US9458144B2 · kind B2 · utility
1Cited by
6References
4Claims
0Family size
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Key dates
| Filing date | Apr 17, 2015 |
| Grant date | Oct 4, 2016 |
| Priority date | — |
| Expiry date | Apr 17, 2035 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC07D493/10
- WIPO fieldOrganic fine chemistry
- WIPO sectorChemistry
Abstract
A monomer (1) is prepared by reacting a compound (9) with a base or metal to form a metal enolate reagent, and reacting the metal enolate reagent with an acyloxyketone compound (8). A polymer derived from the monomer is used as base resin to formulate a resist composition, which is shelf stable and displays a high dissolution contrast, controlled acid diffusion and low roughness in forming positive pattern via alkaline development and in forming negative pattern via organic solvent development.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.