Carboxyl-containing resin, resin composition for solder mask, and method of preparing carboxyl-containing resin
US9458284B2 · kind B2 · utility
0Cited by
2References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 13, 2012 |
| Grant date | Oct 4, 2016 |
| Priority date | — |
| Expiry date | Nov 13, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/3452
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The carboxyl-containing resin in accordance with the present invention has a structure resulting from addition of a carboxylic acid to at least one of epoxy groups of a biphenyl novolac epoxy resin. The carboxylic acid includes at least a polybasic acid.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.