MIM capacitor and method forming the same
US9461106B1 · kind B1 · utility
3Cited by
9References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 16, 2015 |
| Grant date | Oct 4, 2016 |
| Priority date | — |
| Expiry date | Mar 16, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/11
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A package includes an inorganic dielectric layer, and a capacitor. The capacitor includes a bottom electrode having a top surface in contact with a top surface of the inorganic dielectric layer, an insulator over the bottom electrode, and a top electrode over the insulator. The package further includes a polymer layer covering the capacitor, with a portion of the polymer layer being coplanar with the capacitor and encircling the capacitor. The polymer contacts the top surface of the inorganic dielectric layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.