Inventor · Zhunan Town, TW

Yu-Chia Lai

76Patents
5h-index
46Co-inventors
68Inventor score

Filing activity: Aug 24, 2009 → Nov 1, 2023

Most-cited inventions

PatentTitleAreaCited byStatus
US9640498B1 Integrated fan-out (InFO) package structures and methods of forming same Electricity 17 Active
US9153504B2 Metal insulator metal capacitor and method for making the same Electricity 10 Active
US9627332B1 Integrated circuit structure and seal ring structure Electricity 6 Active
US8422227B2 Electronic device and heat dissipation device thereof Electricity 6 Active
US8405987B2 Cooling system for electronic device and electronic device having same Electricity 5 Active
US9559044B2 Package with solder regions aligned to recesses Electricity 4 Active
US9048149B2 Self-alignment structure for wafer level chip scale package Electricity 4 Active
US10847505B2 Multi-chip semiconductor package Electricity 4 Active
US11183487B2 Integrated circuit package and method Electricity 4 Active
US8363401B2 Air guiding device and heat dissipation system having same Emerging Cross-Sectional Technologies 4 Active
US11121052B2 Integrated fan-out device, 3D-IC system, and method Electricity 4 Active
US9852985B1 Conductive terminal on integrated circuit Electricity 3 Active
US10985101B2 Semiconductor package and manufacturing method thereof Electricity 3 Active
US9947630B2 Package with solder regions aligned to recesses Electricity 3 Active
US11502013B2 Integrated circuit package and method Electricity 3 Active
US9461106B1 MIM capacitor and method forming the same Electricity 3 Active
US11088125B2 IPD modules with flexible connection scheme in packaging Electricity 2 Active
US9786618B2 Semiconductor structure and manufacturing method thereof Electricity 2 Active
US11062975B2 Package structures Electricity 2 Active
US10985121B2 Bump structure and fabricating method thereof Electricity 2 Active
US11424213B2 Semiconductor structure including a first surface mount component and a second surface mount component and method of fabricating the semiconductor structure Electricity 2 Active
US8077465B2 Heat sink assembly with fixing member Emerging Cross-Sectional Technologies 1 Active
US11508665B2 Packages with thick RDLs and thin RDLs stacked alternatingly Electricity 1 Active
US9449927B2 Seal ring structure with metal-insulator-metal capacitor Electricity 1 Active
US10269737B2 Method for manufacturing semiconductor structure Electricity 1 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.