Circuits for and methods of providing a charge device model ground path using substrate taps in an integrated circuit device
US9462674B1 · kind B1 · utility
6Cited by
26References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 26, 2013 |
| Grant date | Oct 4, 2016 |
| Priority date | — |
| Expiry date | Jan 31, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03K19/003
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A circuit for providing a ground path in an integrated circuit device is described. The circuit comprises a device region formed in a substrate; a substrate tap formed adjacent to the device region; and a conductive path coupled between the substrate tap and a ground metal layer by way of a plurality of metal layers and vias, wherein the conductive path is configured to meet a predetermined design requirement.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.