Epoxy resin composition and printed circuit board including insulating layer using the epoxy resin composition
US9462689B2 · kind B2 · utility
0Cited by
2References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 22, 2013 |
| Grant date | Oct 4, 2016 |
| Priority date | — |
| Expiry date | Nov 22, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0209
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
An epoxy resin composition according to an embodiment of the present invention includes an epoxy compound, a curing agent including diaminodiphenyl sulfone, and an inorganic filler.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.