Polishing pad with porous interface and solid core, and related apparatus and methods
US9463551B2 · kind B2 · utility
0Cited by
6References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 14, 2014 |
| Grant date | Oct 11, 2016 |
| Priority date | — |
| Expiry date | Aug 15, 2034 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08J2375/04
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Disclosed is a polishing pad for chemical-mechanical polishing. The polishing pad has a porous interface and a substantially non-porous bulk core. Also disclosed are related apparatus and methods for using and preparing the polishing pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.