Apparatus and method for electronic sample preparation
US9465049B2 · kind B2 · utility
3Cited by
34References
20Claims
0Family size
Inventor
Key dates
| Filing date | Apr 10, 2013 |
| Grant date | Oct 11, 2016 |
| Priority date | — |
| Expiry date | Dec 20, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T409/303864
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method and apparatus for preparing electronic samples for a subsequent treatment, e.g., application of a failure analysis treatment. In one embodiment, an electronic device is mounted on a thermally controlled plate and a select temperature is applied thereto. While maintaining the select temperature applied to the thermally controlled plate, a sample preparation process is performed on the electronic device, such as, e.g., performing polishing, thinning, milling, lapping or extracting one or more semiconductor dies that form the electronic device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.