Patent · US Active

Systems and methods for high-speed, low-profile memory packages and pinout designs

US9466571B2 · kind B2 · utility

2Cited by

2References

9Claims

0Family size

Assignee

Apple Inc. · US

Inventors

Anthony Fai · Palo Alto, US
Evan R. Boyle · Cupertino, US
Zhiping Yang · Cupertino, US
Zhonghua Wu · Lo Wu, CN

Key dates

Filing date	Jul 17, 2015
Grant date	Oct 11, 2016
Priority date	—
Expiry date	Jul 17, 2035

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/3025
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Systems and methods are provided for stacked semiconductor memory packages. Each package can include an integrated circuit (“IC”) package substrate capable of transmitting data to memory dies stacked within the package over two channels. Each channel can be located on one side of the IC package substrate, and signals from each channel can be routed to the memory dies from their respective sides.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.