Wafer level stepped sensor holder
US9467606B2 · kind B2 · utility
1Cited by
7References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 10, 2014 |
| Grant date | Oct 11, 2016 |
| Priority date | — |
| Expiry date | Jun 14, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04N23/57
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An apparatus includes an image sensor that is bonded to a spacer. The spacer has a thinned wall that defines a step and a recess in an interior wall at a first end of the spacer. The image sensor is bonded to the step within the recess of the spacer such that the image sensor is accepted completely within the recess of the spacer. A glass wafer is mounted on a second end of the spacer. A lens is mounted on the glass wafer such that light is to be directed through the lens to the image sensor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.