Epoxy resin composition, and printed circuit board using same
US9468096B2 · kind B2 · utility
2Cited by
2References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 6, 2013 |
| Grant date | Oct 11, 2016 |
| Priority date | — |
| Expiry date | Dec 6, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0215
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
According to one embodiment of the present invention, an epoxy resin composition comprises an epoxy compound, a curing agent, and an inorganic filler, wherein the inorganic filler includes boron nitride (BN).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.