Method for fabricating wiring board
US9468109B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 24, 2015 |
| Grant date | Oct 11, 2016 |
| Priority date | — |
| Expiry date | Jun 24, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/066
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A core material is prepared, wherein the core material has an insulating layer, and a conductor pattern provided on a surface of the insulating layer. One or more prepreg materials are prepared. Each prepreg material includes a glass cloth, and first and second resin layers which are formed from a semi-cured resin with which the glass cloth is impregnated, and cover the opposite surfaces of the glass cloth, respectively. A laminated body is formed by placing the one or more prepreg materials on one another, such that one prepreg material out of the one or more prepreg materials is provided on the surface of the insulating layer of the core material to cover the conductor pattern. The laminated body is heated and pressed. The glass cloth has an opening ratio ranging from 3% to 15%. The thickness t of the first and second resin layers, the ratio a (%) of the area of the conductor pattern to the area of the surface of the insulating layer in the core material, the thickness T of the conductor pattern, and the number n of the one or more prepreg materials satisfy the relationships: T≧100 (μm): and t<(1−a/100)·T<2·n·t.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.