Methods of forming articles including metal structures having maximized bond adhesion and bond reliability
US9468986B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 30, 2013 |
| Grant date | Oct 18, 2016 |
| Priority date | — |
| Expiry date | Dec 30, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12396
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Methods of effecting bond adhesion between metal structures, methods of preparing articles including bonded metal structures, and articles including bonded metal structures are provided herein. In an embodiment, a method of effecting bond adhesion between metal structures includes forming a first metal structure on a substrate. The first metal structure includes grains that have a {111} crystallographic orientation, and the first metal structure has an exposed contact surface. Formation of an uneven surface topology is induced in the exposed contact surface of the first metal structure after forming the first metal structure. A second metal structure is bonded to the exposed contact surface of the first metal structure after inducing formation of the uneven surface topology in the exposed contact surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.