Low dissipation factor resin composition and product made thereby
US9469757B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 4, 2015 |
| Grant date | Oct 18, 2016 |
| Priority date | — |
| Expiry date | Jun 4, 2035 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2205/025
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A low dissipation factor resin composition comprises: (A) 100 to 150 parts by weight of a vinyl-containing compound or a polymer thereof; (B) 0 to 75 parts by weight of styrene-butadiene-divinylbenzene terpolymer, styrene-butadiene-maleic anhydride terpolymer, vinyl functional polybutadiene urethane oligomer or a combination thereof; (C) 30 to 150 parts by weight of flame retardant; and (D) 0.1 to 10 parts by weight of peroxide. The resin composition and a product made thereby are applicable to a copper-clad laminate and a printed circuit board, characterized by having low dissipation factor at high frequency and satisfactory thermal resistance and thermal expansion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.