Self-assembled vertically aligned multi-chip module
US9470855B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 11, 2015 |
| Grant date | Oct 18, 2016 |
| Priority date | — |
| Expiry date | Aug 11, 2035 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B2006/12061
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A multi-chip module (MCM) is described. This MCM includes two substrates that are passively self-assembled on another substrate using hydrophilic and hydrophobic materials on facing surfaces of the substrates and liquid surface tension as the restoring force. In particular, regions with a hydrophilic material on the two substrates overlap regions with the hydrophilic material on the other substrate. These regions on the other substrate may be surrounded by a region with a hydrophobic material. In addition, spacers on a surface of at least one of the two substrates may align optical waveguides disposed on the two substrates, so that the optical waveguides are coplanar. This fabrication technique may allow low-loss hybrid optical sources to be fabricated by edge coupling the two substrates. For example, a first of the two substrates may be a III/V compound semiconductor and a second of the two substrates may be a silicon-on-insulator photonic chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.