Polishing apparatus having temperature regulator for polishing pad
US9475167B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 16, 2012 |
| Grant date | Oct 25, 2016 |
| Priority date | — |
| Expiry date | May 3, 2033 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/015
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A substrate polishing apparatus includes: a polishing table supporting a polishing pad; a top ring configured to press the substrate against the polishing pad; and a pad temperature regulator configured to regulate a surface temperature of the polishing pad. The pad temperature regulator includes a pad contact element and a liquid supply system configured to supply a temperature-controlled liquid to the pad contact element. The pad contact element has a space therein and a partition that divide the space into a first liquid passage and a second liquid passage that are connected in series. At least one baffle substantially perpendicular to a radial direction of the polishing table is provided in each of the first liquid passage and the second liquid passage.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.