Polishing pad window

US9475168B2 · kind B2 · utility

Inventors

• Bainian Qian · Newark, US
• Ethan S. Simon · Ambler, US
• George C. Jacob · Newark, US

Key dates

• Filing date: Mar 26, 2015
• Grant date: Oct 25, 2016
• Expiry date: May 12, 2035

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B24B37/26
• WIPO field: Machine tools
• WIPO sector: Mechanical engineering

Abstract

The polishing pad is suitable for polishing or planarizing at least one of semiconductor, optical and magnetic substrates. The polishing pad has a polishing surface, an opening through the polishing pad and a transparent window within the opening in the polishing pad. The transparent window has a concave surface with a depth that increases with use of the polishing pad. A signal region slopes downward into the central region for facilitating debris removal and a debris drainage groove extending through the central region into the polishing pad. Rotating the polishing pad with polishing fluid in the debris drainage groove sends debris from the central region into the polishing pad through the debris drainage groove.