Fabricating a microelectronics lid using sol-gel processing
US9478473B2 · kind B2 · utility
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31References
18Claims
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Key dates
| Filing date | May 21, 2013 |
| Grant date | Oct 25, 2016 |
| Priority date | — |
| Expiry date | Aug 13, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for fabrication of a lid for a microelectronic device is described, wherein the microelectronic device comprises of a die and a laminate. A gel is formed having a coefficient of thermal expansion (CTE) within a threshold percentage value of either a CTE of the die or a CTE of the laminate of the microelectronics device. A metal piece is inserted into the gel to form a lid.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.