Interposer substrate, semiconductor structure and fabricating process thereof
US9478500B2 · kind B2 · utility
10Cited by
4References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 17, 2015 |
| Grant date | Oct 25, 2016 |
| Priority date | — |
| Expiry date | Feb 17, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10378
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Described herein are interposer substrate designs for warpage control, semiconductor structures including said interposer substrates, and fabricating processes thereof. An interposer substrate defines a cavity and further includes a reinforcement structure, wherein the reinforcement structure is used to control warpage of the semiconductor package structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.