Non-covalently crosslinkable materials for photolithography processes
US9482951B2 · kind B2 · utility
2Cited by
5References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 28, 2008 |
| Grant date | Nov 1, 2016 |
| Priority date | — |
| Expiry date | May 21, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31935
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
This invention describes compositions and methods of using non-covalently crosslinked resin coatings for lithographic applications. These materials are designed to undergo, after coating, a change that provides solvent resistance and, with some materials, simultaneous aqueous-base solubility. Non-covalent interactions allow for easier removal of these coatings than of covalently crosslinked materials. These types of materials are well-suited for trench and gap fill applications, as well as for anti-reflective coatings, spin-on carbon layers, and etch masks.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.