Electronic system with a composite substrate
US9484290B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 18, 2013 |
| Grant date | Nov 1, 2016 |
| Priority date | — |
| Expiry date | Apr 12, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1327
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A composite substrate made of a conductive pattern structure mounted on a lead frame is used for an electronic system package. High heat generated electronic components are adapted to mount on the lead frame and relatively low heat generated electronic components are adapted to mount on the conductive pattern structure. Metal lines are used for electrical coupling between the circuitry of the IC chip and the conductive pattern structure. An electronic system with the composite substrate gains both advantages—good circuitry arrangement capability from the conductive pattern structure and good heat distribution from the lead frame.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.