Thermal tube assembly structures
US9485851B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 3, 2014 |
| Grant date | Nov 1, 2016 |
| Priority date | — |
| Expiry date | Apr 3, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20145
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Various embodiments described herein disclose systems, methods and/or devices used to dissipate heat generated by electronic components of an electronic assembly that further includes a first assembly rail, a top circuit board and a bottom circuit board. The first assembly rail includes a first card guide structure and a second card guide structure that are arranged on a first side of the first assembly rail near two opposite ends of the assembly rail. The top and the bottom circuit boards are mechanically coupled to the first and second card guide structures of the first assembly rail, respectively. The top circuit board is parallel to the bottom circuit board, and separated from the bottom circuit board by a predefined distance. The first assembly rail, the top circuit board and the bottom circuit board together form a channel there between for receiving a heat dissipating airflow.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.