Polishing composition
US9486892B2 · kind B2 · utility
8Cited by
4References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 29, 2013 |
| Grant date | Nov 8, 2016 |
| Priority date | — |
| Expiry date | Oct 29, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/3212
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
[Problem] Provided is a polishing composition which is suitable for polishing a polishing object having a metal wiring layer and capable of diminishing the step defect while maintaining a high polishing rate.[Solution] Provided is a polishing composition used in polishing a polishing object having a metal wiring layer, which contains a metal corrosion inhibitor, a complexing agent, a surfactant, and water and in which the solid surface energy of the polishing object surface after polishing the polishing object using the polishing composition is 30 mN/m or less, and the surfactant is preferably an anionic surfactant.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.