Chemical mechanical polishing (CMP) composition comprising a glycoside

US9487674B2 · kind B2 · utility

Assignee

• BASF SE

Inventors

• Yuzhuo Li
• Michael Lauter · Mannheim, DE
• Roland Lange · Schifferstadt, DE

Key dates

• Filing date: Sep 4, 2012
• Grant date: Nov 8, 2016
• Expiry date: Sep 4, 2032

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/31053
• WIPO field: Basic materials chemistry
• WIPO sector: Chemistry

Abstract

A chemical mechanical polishing (CMP) composition comprising (A) inorganic particles, organic particles, or a mixture or composite thereof, (B) a glycoside of the formulae 1 to 6 wherein R1 is alkyl, aryl, or alkylaryl, R2 is H, X1, X2, X3, X4, X5, X6, alkyl, aryl, or alkylaryl, R3 is H, X1, X2, X3, X4, X5, X6, alkyl, aryl, or alkylaryl, R4 is H, X1, X2, X3, X4, X5, X6, alkyl, aryl, or alkylaryl, R5 is H, X1, X2, X3, X4, X5, X6, alkyl, aryl, or alkylaryl, and the total number of monosaccharide units (X1, X2, X3, X4, X5, or X6) in the glycoside is in the range of from 1 to 20, and (C) an aqueous medium.