Test socket having high-density conductive unit, and method for manufacturing same
US9488675B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Apr 3, 2013 |
| Grant date | Nov 8, 2016 |
| Priority date | — |
| Expiry date | Apr 3, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R12/73
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The present invention relates to a test socket having a high-density conductive unit, and to a method for manufacturing same, whereby an elastic conductive sheet is arranged at a position corresponding to the terminal of the device, and includes a first conductive unit arranged in the thickness direction of an elastic material and an insulating support unit for supporting the first conductive unit. A support sheet is attached to the elastic conductive sheet and has through-holes corresponding to the terminal of the device. A second conductive unit is arranged in the through-holes of the support sheet in the thickness direction in an elastic material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.