Patent · US Active

Transmitting and receiving package

US9490198B1 · kind B1 · utility

6Cited by

1References

13Claims

0Family size

Assignee

KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY · KR

Inventor

Yong Sung EOM · Daejeon, KR

Key dates

Filing date	Dec 3, 2015
Grant date	Nov 8, 2016
Priority date	—
Expiry date	Dec 3, 2035

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/37001
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Provided is a transmitter and receiver package including an interposer substrate including a top surface, a bottom surface facing the top surface, and a through-via, semiconductor devices mounted on the top surface of the interposer substrate, an exothermic element mounted on the bottom surface of the interposer substrate, and a heat dissipation member disposed on the bottom surface of the interposer substrate, the heat dissipation member being configured to cover the exothermic element.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.