Semiconductor package with shielding member and method of manufacturing the same
US9490219B2 · kind B2 · utility
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16Claims
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Key dates
| Filing date | Aug 14, 2014 |
| Grant date | Nov 8, 2016 |
| Priority date | — |
| Expiry date | Aug 14, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
This invention provides a semiconductor package, including a substrate, a plurality of semiconductor elements disposed on the substrate, at least one shielding member disposed between at least two of the semiconductor elements, and an encapsulant encapsulating the semiconductor elements and shielding members. Through the shielding member, electromagnetic interference caused among semiconductor elements can be prevented.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.