Semiconductor devices having contact plugs overlapping associated bitline structures and contact holes and method of manufacturing the same
US9490256B2 · kind B2 · utility
6Cited by
16References
15Claims
0Family size
Assignee
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Key dates
| Filing date | Jun 29, 2015 |
| Grant date | Nov 8, 2016 |
| Priority date | — |
| Expiry date | Jun 29, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10B12/488
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device can include a plurality of landing pads arranged according to a layout on a substrate, wherein a cross-sectional shape of each of the landing pads has a diamond shape so that opposing interior angles of the diamond shape are equal to one another and adjacent interior angles of the diamond shape are unequal to one another.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.