Wafer formed by slicing an ingot
US9490326B2 · kind B2 · utility
0Cited by
0References
2Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 29, 2015 |
| Grant date | Nov 8, 2016 |
| Priority date | — |
| Expiry date | Apr 29, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24777
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The instant disclosure relates to a wafer formed by slicing an ingot. The wafer has at least one side surface adjacent to the slicing path and topped with a nanostructure layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.