Circuit board and method for manufacturing the same
US9491865B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 24, 2015 |
| Grant date | Nov 8, 2016 |
| Priority date | — |
| Expiry date | Apr 24, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10734
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A circuit board with a heat-recovery function includes a substrate, a heat-storing device, and a thermoelectric device. The heat-storing device is embedded in the substrate and connected to a processor for performing heat exchange with the processor. The thermoelectric device embedded in the substrate includes a first metal-junction surface and a second metal-junction surface. The first metal-junction surface is connected to the heat-storing device for performing heat exchange with the heat-storing device. The second metal-junction surface is joined with the first metal-junction surface, in which the thermoelectric device generates an electric potential by a temperature difference between the first metal-junction surface and the second metal-junction surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.