Microelectronic socket comprising a substrate and an insulative insert mated with openings in the substrate
US9491881B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 27, 2014 |
| Grant date | Nov 8, 2016 |
| Priority date | — |
| Expiry date | Aug 12, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49222
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A microelectronic socket having a two piece construction, wherein a first piece comprises a conductive socket substrate and the second piece comprises an insulative insert. The conductive socket substrate has a first surface, a second surface, and at least one opening extending therebetween. The insulative insert has a base portion with at least one projection extending therefrom. The insulative insert is mated with the conductive socket substrate such that the at least one projection resides within a corresponding conductive socket substrate opening. The insulative insert further includes a plurality of vias, wherein at least one of the plurality of vias extends through the insulative base and through an insulative insert projection, wherein a contact may be disposed within the via.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.