Patent · US Active

Copper electrodeposition in microelectronics

US9493884B2 · kind B2 · utility

0Cited by

35References

13Claims

0Family size

Inventors

Vincent Paneccasio, Jr. · Madison, US
Richard Hurtubise · Clinton, US
Xuan Lin · Northford, US
Paul Figura · Orange, US

Key dates

Filing date	Dec 17, 2013
Grant date	Nov 15, 2016
Priority date	—
Expiry date	Nov 7, 2034

Classification

Technology area (CPC H)Electricity
CPC primaryH01L21/76879
WIPO fieldSurface technology, coating
WIPO sectorChemistry

Abstract

A method and composition for electroplating Cu onto a substrate in the manufacture of a microelectronic device involving and electrolytic solution containing a source of Cu ions and a quaternized pyridinium salt compound for leveling.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.