Methods of selectively transferring active components
US9496155B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 22, 2011 |
| Grant date | Nov 15, 2016 |
| Priority date | — |
| Expiry date | Nov 23, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for selectively transferring active components (22) from a source substrate (20) to a destination substrate (10) includes providing a source substrate with one or more active components located on the source substrate, providing a destination substrate, locating a selectively curable adhesive layer (30) between and adjacent to the destination substrate and the source substrate, selecting one or more active components (22A), selectively curing area(s) (32A) of the adhesive layer corresponding to the selected active components to adhere the selected active components to the destination substrate, and removing the source substrate from the destination substrate leaving the selected active components adhered to the destination substrate in the selected areas.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.